ʻO PCB Heat Lamination Buffer Pad

Hiʻona o Sanpu Silicone Sponge Pad:

1. Ke kū'ē i ka wela kiʻekiʻe a me ke kūpaʻa ʻana o ka wela: ʻAʻole- pauka a ʻaʻohe paʻakikī ma hope o ka hoʻomau ʻia ʻana o ka lamination wela kiʻekiʻe.

2.Low Contamination & Environment Friendly:Holo i ka RoHS a me ka FDA

3. Pa'a -Cell Structure: I ka wā o ka lamination, ʻaʻole e komo ka mahu wai i hoʻokuʻu ʻia e nā papa a hiki ke hoʻokuʻu ʻia me ka maʻalahi, e hōʻemi ana i nā hemahema e like me nā ʻōhū, nā kiko keʻokeʻo a me ka delamination.

4.Chemical paʻa: ʻAʻole ia e pane me ka epoxy resin a i ʻole PP prepreg resin a ʻaʻole ia e hoʻopōʻino i ke keleawe keleawe.

Ka pono o ka Silicone Sponge E like me ka PCB heat lamination buffer pad

1. ʻO ke kūpaʻa kino maikaʻi e uku i ka ʻokoʻa o ka mānoanoa keleawe a me ka like ʻole o ka papa
2. Ka hāʻawi like ʻana i ke kaomi ʻana, liʻiliʻi ka delamination, ʻaʻohe, nā hemahema komo keleawe
3. ʻO ke kūpaʻa wela kiʻekiʻe a me ka hana wela paʻa
4. Paʻa-ka hale no ka hoʻoheheʻe wai maikaʻi
5. Haʻahaʻa sulfur & haʻahaʻa volatiles, haʻahaʻa contamination, hana maʻemaʻe
6. Hiki ke hoʻohana hou ʻia, hiki ke hoʻohana hou ʻia, hiki ke hoʻopaʻa ʻia i ka waimaka-kūʻokoʻa, kūpono ākea no HDI, keleawe kaumaha, PCB step

E koho iā Sanpu Silicone

1. ʻO mākou kahi mea hoʻolako silicone sponge kumu

2. Loaʻa iā mākou ma mua o 16 mau makahiki o ka hana ʻana o ka silicone sponge

3.Mandatory inspection ma mua o ka haʻalele ʻana i ka hale hana, pili ʻia ka hōʻike nānā maikaʻi

4.Free laʻana, e hoʻokaʻaʻike mai iā mākou e kiʻi manuahi